Ho Chi Minh City Infrastructure Investment Joint Stock Company announces the record date for bond interest payment as follows:

-          Bond name: CII122020 Bond

-          Bond code: CII11722

-          Purpose: to pay for the bond interest (from December 29, 2019 to June 29, 2020)

-          Record date: June 12, 2020

-          Payment date: June 29, 2020

-          Place of payment:

+ Bondholders whose bonds have been deposited: at the securities firms where the bonds have been deposited.

+ Bondholders whose bonds have not been deposited: at Ho Chi Minh City Securities Corporation (20^th Floor, Sun Wah Building, 115 Nguyen Hue, Ben Nghe ward, district 1, HCMC).