FECON Corporation announces a BOD resolution of a bond private placement as below.

Acticle 1: Approving the plan of bond private placement approved by AGM.

-          Total issued value: 150 bil. dongs

-          Issued volume: 150,000 bonds

-          Object: professional investors

-          Offering price: minimum 100% par value

-          Planning issued date: 13 June 2022

-          Term: 18 months

-          Interest ratio: 11%/ year

-          Interest payment term: every 3 months

Acticle 2: Approving the using of collateral asset for the bond private placement.

Acticle 3: Assigning the Chairman deciding the using of collateral asset.