On May 29, 2020, the Board of Directors of Techcom Securities Joint Stock Company (TCBS) allowed Mr. Do Tuan anh to sell the bonds issued by Vinfast to Techcom Securities Joint Stock Company as follows:
1) Seller: Do Tuan Anh
2) Information on the bond:
− Issuer: Vinfast LLC
− Type of bond: non-convertible unsecured bond, no warrants
− Bond name: Bond VF12202224
− Par value: VND100,000/bond
− Total issue par value: VND5,000,000,000,000.
− Issue date: December 17, 2019
− Maturity date: December 17, 2022
− Bond interest rate:
- For the first four interest payment periods: 10%/year;
- For the next interest payment periods: the average interest rate of individual savings deposit, term of 12 months, post paid, announced by BIDV, VCB, Vietinbank and Techcombank, plus 4%/year.
− Interest payment period: every 03 months
− Underwriter: Vingroup
− Number of bonds: 195,000 bonds
− Total par value of bonds: VND19,500,000,000
− Selling price: VND20,003,081,962
− Trading date: May 29, 2020
The Board of Directors authorized Mr. Nham Ha Hai, Deputy CEO, to execute the transaction and sign relevant agreements.