The Board resolution dated September 03, 2019, the Board of Directors of Vietnam Technological and Commercial Joint Stock Bank approved the plan for the bond issuance in 2019 as follows:

-          Issuer:  Vietnam Technological and Commercial Joint Stock Bank

-          Bond name: Techcombank bond

-          Bond type: non-convertible bond, unsecured and without warrants

-          Par value: 1,000,000,000 dongs/bond

-          Issue volume:  VND10,000 billion

-          Issue currency: VND

-          Issue country: Vietnam

-          Issue place: Techcombank Tower, 191 Ba Trieu, Le Dai Hanh, Hai Ba Trung, Hanoi.

-          Bond form: book entry

-          Issue method: private placement

-          Bond term: 03 years

-          The bonds interest will be paid on the maturity date and payment date before maturity.

-          Number of expected issues: 10 phases (Each phase will expect to issue: VND5,000 billion).

-          Time of implementation: expected in Q3.2019 & Q4.2019

-          Place for interest payment: to transfer to the bondholder's account.

-          Total proceeds from the bond issuance will be used to make a loan to customers.

-          The firms participating in the bond issuance:

+ Issue consultancy agent: Techcom Securities Joint Stock Company (TCBS)

+ Depository and payment agent: Techcom Securities Joint Stock Company (TCBS).