Hochiminh Stock Exchange announces the record date for bond interest and principal payment as follows:

-       Bond name: CII072019 Bond

-       Bond code: CII11803

-       ISIN code: VN0CII118037

-       Bond type: corporate bond

-       Par value: VND100,000

-       Bond term: 366 days

-       Issue date: July 27, 2018

-       Maturity date: July 28, 2019

-       Interest rate: 9.5%/year

-       Purpose: to pay interest (from January 27, 2019 to July 28, 2019) and principal on the maturity date of July 28, 2019.

-       Payment amount: VND104,763.014/bond

-       Record date:        July 15, 2019

-       Payment date:      July 29, 2019

-       Place of payment:

• For bondholders whose bonds have been deposited: Bondholders will fulfill procedures to receive bond interest and principal at the securities firms where the bonds have been deposited.
• For bondholders whose bonds have not been deposited: The bond interest and principal will be paid to the bondholders’ accounts which were registered at Techcom Securities Joint Stock Company from July 29, 2019.