On June 13, 2019, the Hochiminh Stock Exchange issued Announcement No. 859/TB-SGDHCM about the record dated for the fourth bond interest payment period of VINGROUP Joint Stock Company as follows:
- Ex-right date: June 19, 2019
- Record date: June 19, 2019
- Interest rate: 11.05%/year
- Payment amount: VND5,555.694 for 01 bond
- Payment date: July 03, 2019
- Place of payment:
+ Shareholders whose bonds have been deposited: at the securities firms where the bonds have been deposited.
+ Shareholders whose bonds have not been deposited: at Techcom Securities Joint Stock Company (TCBS).