The Board resolution dated January 22, 2019, Refrigeration Electrical Engineering Corporation approved the following issues:

1. Approving the plan for the bond issuance:

-       Issuer: Refrigeration Electrical Engineering Corporation

-       Bond name: REE-BOND2029

-       Bond type: non-convertible bond, secured and without warrants.

-       Par value: VND1,000,000,000

-       Expected issue volume: 2,320 bonds

-       Issue price: 100% par value

-       Total value (based on par value): VND2,320,000,000,000

-       Number of phases of bond issuance: 01 phase

-       Issue date: expected in Q1.2019

-       Issue method: private placement

-       Issue agency: Standard Chartered (Vietnam)

-       Bond owner representative: Ho Chi Minh City Securities Corporation (HSC)

-       Registration, transfer, principle and interest payment bond: Ho Chi Minh City Securities Corporation (HSC)

-       The new bonds are freely transferable

-       Issue currency: VND

-       Term: 10 years

-       Term of interest payment: 7.3%/year

-       Interest payment method: Once every six months from the issue date.

2. Approving the Credit Guarantee and Investment Facility (CGIF) (a Trust Fund of Asian Development Bank) to be a guarantee for the company’s bond payment obligation (Guarantee) and mortgage the company's assets to secure the company’s obligations with CGIF under guarantee and bond conditions.